Glass packaging is a critical component in the production of silicon-based organic electroluminescent organic light-emitting diode (OLED) microdisplays. This study investigates the impact of two curing methods—thermal curing and UV curing—on the reliability of glass encapsulation technology. Key parameters, such as encapsulation efficiency, alignment precision, bonding strength, resistance to environmental aging, and photoelectric performance, were evaluated for both encapsulation systems. Consequently, the UV-curing glass encapsulation outperforms thermal curing in terms of resistance to environmental aging, bonding strength, alignment precision, and manufacturing efficiency. However, the difference in photoelectric performance between the two methods is negligible.