In order to achieve surface metallization on glass substrates, metallic copper was directly deposited on the surface of conventional transparent silicate glass by means of laser-induced plasma deposition technology with a T2 copper target and a cheap and easily-maintained 1064nm wavelength infrared nanosecond fiber laser. Micro-morphology of the copper deposition layer was observed by an optical microscope and a scanning electron microscope. The results show that, in the range of laser energy density from 12.50J/cm2 (deposition threshold) to 27.13J/cm2 (the maximal fluence of the laser), the deposition amount of copper particles on the glass surface increases with the increase of laser fluence. Under the condition of constant laser fluence (e.g.,27.13J/cm2) and the same horizontal and vertical spot overlaps, copper deposition process fails if the spot overlap percentage is equal to or large than 50% bcause of the strong absorption of laser by glass. And if the overlap percentage ranges from -20% to 50%, deposition amount of copper particles has a tendency of increase firstly and then decrease. Laser-induced plasma deposition technology is a facile process to realize surface metallization on transparent substrate material.