APPLIED LASER, Volume. 43, Issue 12, 60(2023)
Research on Porous Materials of Low Elastic Modulus Based on Selective Laser Melting Process
This research focuses on developing a low elastic modulus porous material that aligns with human bone structure and mechanical requirements. The material was developed using Ti6Al4V powder and selective laser melting technology, reflecting the properties of compact and cancellous bones. A model was established by imitating the porous structure of cancellous bone and achieving a porosity rate of 44.92%, following the principle of density similarity to compact bone. The influence of different energy densities (50 J/mm2, 51.8 J/mm2) and pore sizes (500 μm, 1 000 μm, 1 500 μm) on the relevant properties of the porous material was studied. The results showed that the bulk porous structure material prepared based on the above conditions had good formability, uniform and controllable pore size, unobstructed pore channels, controllable dimensional accuracy. The porosity rate increased with the increase of pore size, and the pore size of 500 μm was closer to the design porosity rate parameter. As the pore size increased, it was positively correlated with the tensile strength, but the elastic modulus gradually decreased. The formed quality of the solid part was good, and the tensile test fracture indicated that there were basically no stress defects such as cracks. There were varying degrees of shrinkage pores after melting in all samples, which was a natural characteristic of powder melting and solidification. The porous structure can achieve the design requirements of low elastic modulus, and the sample formed at an energy density of 51.8 J/mm2 reached a tensile strength of 70 MPa and an elastic modulus of 18 GPa at a pore size of 500 μm, which was closer to the performance of human compact bone.
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Tang En, Fang Yangming, Wang Kun, Liu Jingqi, Zhang Rui. Research on Porous Materials of Low Elastic Modulus Based on Selective Laser Melting Process[J]. APPLIED LASER, 2023, 43(12): 60
Received: May. 10, 2023
Accepted: --
Published Online: May. 23, 2024
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