Co-Packaged Optics | Researching

Advanced Photonics Nexus invites submissions to the theme issue titled “Co-Packaged Optics”; the theme issue will publish in conjunction with a related theme issue in the journal Intelligent Computing.

Co-packaged optics (CPO) is an emerging, transformative technology that integrates optical interconnects directly with electronic components, addressing the increasing demands for higher bandwidth, lower latency, and improved energy efficiency. Recent advancements in integrated photonics, high-speed optical transceivers, and advanced packaging techniques are reshaping the landscape of high-performance computing and telecommunications.

Additionally, we encourage submissions that explore the intersection of artificial intelligence (AI) in the context of co-packaged optics to be submitted to Intelligent Computing [Guest Editors: Ting Mei (Northwestern Polytechnical University, China), Surya Bhattacharya (Institute of Microelectronics, A*STAR, Singapore); and Shaoliang Yu (Zhejiang Lab, China)]. As AI techniques become increasingly integrated with photonic systems, they offer powerful tools for optimizing optical-electronic integration, managing thermal effects, and enhancing system performance. We particularly welcome contributions that investigate AI-driven methods for design optimization, fault detection, adaptive control, and performance prediction in CPO-based systems.

This special theme issue aims to provide a comprehensive overview of state-of-the-art research in CPO, encompassing innovative device architectures, advanced materials, thermal management solutions, and robust integration strategies. We invite both experimental and theoretical contributions that showcase novel approaches and breakthroughs in this rapidly evolving field.

Topics of interest include, but are not limited to:

•Integrated optical-electronic platforms

•Advanced packaging techniques for optical transceivers

•Thermal management strategies for high-density opto-electronic modules

•High-speed photonic and electronic integration

•Innovations in optical interconnects and fiber coupling techniques

•Emerging materials and fabrication methods for CPO

•Reliability and scalability of optical-electronic designs

•Co-design strategies for electronic and photonic convergence in communication systems

•Applications in data centers, next-generation networks, and high-performance computing

All papers will undergo a rigorous peer review process. Manuscripts for Advanced Photonics Nexus should be prepared in accordance with the journal guidelines. Authors must include a cover letter indicating that the submission is intended for this spedial theme issue.