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Microelectronics
Editors-in-Chief
Xiaojun Fu
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CN50-1090/TN
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1004-3365
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Research on the Mechanism of Silica-Gel Cracking on the Side Wall of Nickel Plated Metallic Package
CHEN Rong, XIAO Ling, LU Ke1, LUO Chi, LIAO Xiyi, HU Yanbin, ZHANG Ying, and CUI Wei
Jan. 03, 2024
Microelectronics
DOI:10.13911/j.cnki.1004-3365.220403
Study on Thermal Stress of Eutectic Die Attach on K1-5 Shell
LI Jinlong, JIANG Kai, ZHU Hongjiao, and QIU Sheng
Jan. 03, 2024
Microelectronics
DOI:10.13911/j.cnki.1004-3365.230085
Research on Bending Model of Cantilever Beam for MEMS Microwave Power Sensors
WANG Debo, and SUN Haoyu
Jan. 03, 2024
Microelectronics
DOI:10.13911/j.cnki.1004-3365.230021
Effect of Floating Electrodes on the Characteristics of Shielded Gate Trench MOSFET
ZHAN Tao, and FENG Quanyuan
Jan. 03, 2024
Microelectronics
DOI:10.13911/j.cnki.1004-3365.230048
Investigation of the Effect of Conduction Mechanism on Electrothermal Characteristics in JLNT-FET and IMNT-FET
LIU Xianting, LIU Weijing, and LI Qinghua
Jan. 03, 2024
Microelectronics
DOI:10.13911/j.cnki.1004-3365.230044
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A High Speed and High Bandwidth DAC on SiGe Technology
Microelectronics
Vol. 53, Issue 3, 372 (2023)
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An Average Resistor Network Design for Pre-Amplifier
Microelectronics
Vol. 53, Issue 3, 379 (2023)
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Design of an Active Filter Based on Fractional-Order Memcapacitor
Microelectronics
Vol. 53, Issue 1, 19 (2023)
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A High CMTI Differential TIA Circuit for Optically Isolated IGBT Gate Driver Chip
Microelectronics
Vol. 53, Issue 1, 25 (2023)
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A Low-Power and High-Performance Bootstrap Sampling Switch
Microelectronics
Vol. 53, Issue 1, 14 (2023)
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A Segmented Temperature Compensated Bandgap Reference with High PSRR
Microelectronics
Vol. 53, Issue 1, 8 (2023)
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