With the advancement of infrared technology, infrared detector assemblies are developing towards smaller size and higher resolution. Small pitch and large area array specifications are important directions for the development of long-wavelength detectors. Through the research of 10 m pitch, 9 m cut-off wavelength, and 1280×1024 long-wave detector arrays, breakthroughs have been made in 10 m-pitch long-wavelength pixel junction technology, 10 m-pitch indium column preparation and interconnection technology. A long-wavelength 1280×1024 HgCdTe detector chip with an effective pixel rate of 994% or more and a non-uniformity of less than or equal to 4% has been developed.

In order to evaluate the infrared multi-band imaging-guided weapon accurately, the infrared multi-band target simulation technology has become a research hotspot at home and abroad. In this paper, the development status of hardware-in-the-loop infrared multi-band target simulation system abroad in recent years is introduced in detail from the aspects of the composition, working principle, technical indicators and characteristics,which has a certain reference significance for the subsequent development of the domestic infrared multi-band target simulation technology.

In the process test of indium column evaporation of infrared detector, sometimes it is necessary to measure a large amount of indium column heights, so the measurement method of indium column height is studied in this paper. The manual method which measures point by point can get accurate results. But the measurement speed is slow and it takes a lot of time.The rapid automatic measurement method uses the scanning function of the microscope and the image recognition technology to automatically identify the indium columns. It can obtain the heights of all indium columns at one time, so the measurement speed is very fast.The steps, procedures and key option settings of the two methods are introduced in detail in this paper.It is estimated that the second rapid measurement method only takes 30 minutes to measure the heights of 1000 indium columns, reducing the measurement time by 76% and greatly improving the measurement efficiency.Finally, the advantages and disadvantages of the two different measurement methods are analyzed.

The original structure and the added balance layer structure of the 2048×2048 (15 m) infrared focal plane dewar cold head are analyzed by finite element method. Adding a balance layer with a lower expansion coefficient under the ceramic substrate can relieve the deformation and thermal stress of the detector chip to a certain extent. By increasing the diameter of the upper surface of the AlN balance layer, the warpage range beyond the center of the chip is reduced, and the problem of excessive stress concentration is alleviated. When the diameter exceeds the diagonal length of the chip, the maximum thermal stress decreases sharply, and finally tends to be stable; the deformation of the chip decreases rapidly. When the diameter is 36 mm, it reaches a minimum of 686 m; then it increases slowly and tends to be stable. When the diameter of the AlN balance layer exceeds the diagonal length of the chip, the influence of the thickness of the AlN balance layer on the chip deformation begins to decrease. The deformation and thermal stress of the large area array focal plane detector chip can be effectively improved by adding an AlN balance layer. The reliability of the detector Dewar component can be further optimized by adjusting the structure of the AlN balance layer.

Aiming at the problems of large number of clapboards and difficult assembly process in the traditional design scheme of infrared detector cold shield, a simplified design method of infrared detector cold shield is proposed in this paper. This method reduces the number of cold shield partitions, the thermal mass of cold head and the limitation of space on cold shield design.Because this method ignores the window seat of thermal radiation, two kinds of cold shield structures of a mid-wave infrared detector are designed by using the traditional scheme and the simplified scheme respectively, and the LightTools software is used to simulate the influence of window seat thermal radiation on infrared detector and the suppression efficiency of cold shield to field light in order to validate its feasibility. The simulation results show that when the ambient temperature of the detector is 344 K, the noise difference caused by the thermal radiation of the window seat on the infrared detector is not more than 03 mV.The difference is negligible compared with the signal intensity, and the suppression efficiency of the two cold shields is only 02% different, which verifies the feasibility of the design method.

The focused ion beam scanning electron microscope system combines the advantages of scanning electron microscope and focused ion beam system.Based on the advantages of high resolution, in-situ processing and observation, its applications in defect anatomical analysis, pixel anatomical analysis, transmission electron microscope sample preparation and circuit repair are studied in this paper. The method of locating pixels with problems and the specific process of circuit repair are introduced in detail, and its important role in the development of infrared focal plane detectors is illustrated.The system is an indispensable characterization means in the development of high-performance infrared detectors.

As a key technology in infrared detector packaging, the quality of lead bonding directly affects the performance and service life of infrared detector components.The height between solder joints is adjusted by bonding ceramic gaskets of different thicknesses between the ceramic substrate and the readout circuit. After bonding, DAGE-SERIES-4000-PXY tension tester is used to obtain the lead tension under different height differences.Experimental results show that the lead strength is the highest when there is no ceramic gasket bonded between the ceramic substrate and the readout circuit. As the thickness of ceramic gasket increases, the lead strength decreases.

Large laser gyro is an inertial sensor based on Sagnac effect.As the size increases, the fundamental mode operation and gain become important parameters. Aiming at lens matching, discharge current size and cavity length, the characteristic parameters of ABCD matrix and Gaussian beam are calculated, and the influence of the waist spot position of the ring cavity and the discharge current on the diaphragm under different side lengths are verified in this paper.The results show that the quality of the light spot at the light threshold is the best. At this time the light spot is the flattest, and the ratio is close to 1. The symmetrical structure is conducive to efficient signal reading.This has certain reference significance for the cavity design of large laser gyro.