INFRARED, Volume. 43, Issue 2, 40(2022)
Influence of Height Difference Between Wedge Solder Joints on the Strength of Lead Wire
As a key technology in infrared detector packaging, the quality of lead bonding directly affects the performance and service life of infrared detector components.The height between solder joints is adjusted by bonding ceramic gaskets of different thicknesses between the ceramic substrate and the readout circuit. After bonding, DAGE-SERIES-4000-PXY tension tester is used to obtain the lead tension under different height differences.Experimental results show that the lead strength is the highest when there is no ceramic gasket bonded between the ceramic substrate and the readout circuit. As the thickness of ceramic gasket increases, the lead strength decreases.
Get Citation
Copy Citation Text
YUAN Yu-hui. Influence of Height Difference Between Wedge Solder Joints on the Strength of Lead Wire[J]. INFRARED, 2022, 43(2): 40
Category:
Received: Sep. 14, 2021
Accepted: --
Published Online: Jun. 14, 2022
The Author Email: Yu-hui YUAN (1093565695@qq.com)