Analysis of Progress of Micro-system Key Technology in 2019

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[3] [3] Won Y C, Kwan K P. Array type miniaturized ultrasonic sensors to detect urban sinkholes[J]. Measurement, 2019, 141: 371-379.

[4] [4] Yang L, Chen M, Zhu Q. Development of a small-diameter and high-resolution industrial endoscope with CMOS image sensor[J]. Sensors and Actuators A, 2019, 296: 17-23.

[5] [5] Giovanni B, Liang B, Zhang L F. A wireless mini-scope for deep brain imaging in freely moving mice[J]. Journal of Neuroscience Methods, 2019, 323: 56-60.

[6] [6] Zhang SH, Deng S F, Wang Z M. A miniature SMS-LPG bending sensor with high sensitivity based onmultimode fiber embedded-LPG[J]. Sensors and Actuators A, 2019, 295: 31-36.

[7] [7] Gorbunov M S. Design of fault-tolerant microprocessors for space applications[J]. Acta Astronautica, 2019: 252-258.

[8] [8] George O, Raed A A, Mohammed N. Transient thermal analysis and optimization of convective-radiative porous fin under the influence of magnetic field for efficient microprocessor cooling[J]. International Journal of Thermal Sciences, 2019, 145: 106019.

[9] [9] Monir Z, Mustafa M, Ayse K. CAPE: a cross-layer framework for accurate microprocessor power estimation[J]. Integration, the VLSI Journal, 2019, 68: 87-98.

[10] [10] Chen L, Huang Y, Qian ZH F. A novel mask technology of glass HF etching and application in photovoltaic cells[J]. Journal of Alloys and Compounds, 2019, 783: 428e433.

[11] [11] Zhou W, Chen J, Gao H, et al. Anomalous and polarization-sensitive photoresponse of Td-WTe2 from visible to infrared light [J]. Adv Mater, 2019, 31: 1804629.

[12] [12] Wang Q, Yesilyurt C, Liu F, et al. Anomalous photo thermo electric transport due to anisotropic energy dispersion in WTe2[J]. Nano Letter, 2019, 19: 2647-52.

[13] [13] Chen H, Li Y, Wu H, et al. Unusual polarization and temperature-dependent Raman response in Weyl semimetal NbIrTe4[J]. Solid State Communication, 2019, 289: 56-60.

[14] [14] Ma C, Yan J, Huang Y, et al. Photoluminescence manipulation of WS2 flakes by an individual Si nanoparticle[J]. Mater Horiz, 2019, 6: 97-106.

[15] [15] Sebastian K, Irene B, Marcel J. 3D system integration on 300 mm wafer level: high-aspect-ratio TSVs with ruthenium seed layer by thermal ALD and subsequent copper electroplating[J]. Microelectronic Engineering, 2019, 205: 20-25.

[16] [16] Dai Y W, Zhang M, Qin F. Effect of silicon anisotropy on interfacial fracture for three Dimensional through-silicon-via (TSV) under thermal loading[J]. Engineering Fracture Mechanics, 2019, 209: 274-300.

[17] [17] Xia K Q, Zhu ZH Y, Zhang H Z. Modeling simplification for thermal mechanical stress analysis of TSV interposer stack[J]. Microelectronics Reliability, 2019, 96: 46-50.

[18] [18] Gao M Y, Han X F, Zhan X H. Enhancement in photoelectric performance of flexible perovskite solar cells by thermal nanoimprint pillar-like nanostructures[J]. Materials Letters, 2019, 248: 16-19.

[19] [19] SekliBela?di F, Farouil L, Salvagnac L. Towards integrated multi-sensor platform using dual electrochemical and optical detection for on-site pollutant detection in water[J]. Biosensors and Bioelectronics, 2019, 132: 90-96.

[20] [20] Zhang R, Wang ZH K, Zhang Y L. A person-following nano-satellite for in-cabin astronaut assistance: system design and deep-learning-based astronaut visual tracking implementation[J]. Acta Astronautica, 2019, 162: 121-134.