Study On Optical Communications, Volume. 50, Issue 5, 24003001(2024)

Board Level Signal Integrity Study of Ultra-High-Speed Optical Module for Data Centers

Guangcheng Zhong, Congbiao Lei, Yuxuan Jiang, and Liang Xie*
Author Affiliations
  • Key Laboratory of Optoelectronic Materials and Devices, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
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    Figures & Tables(13)
    Basic architecture of the 400 Gbit/s QSFP-DD optical module
    Simulation model and equivalent circuit
    The influence of the radius of each layer back pad of differential hole on the transmission performance
    Simulation model of the inner BGA connection structure
    Influence of inner BGA connection structure anti pad on transmission performance
    Five different anti pad shapes and vias places of the inner BGA connection structure
    7 SDD21 simulation results of the inner BGA connection structure with five different anti pad shapes and vias places
    Simulation model of optical module PCB high-speed channel
    Mixed-mode S-parameters of 3 groups of high-speed channel on optical module PCB
    Simulated eye diagram results of optical module PCB high-speed channel
    Test platform of optical module
    SDD11 test results of optical module in high speed channel
    Comparison of simulation and test results of impedance distribution in high speed channel of optical module
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    Guangcheng Zhong, Congbiao Lei, Yuxuan Jiang, Liang Xie. Board Level Signal Integrity Study of Ultra-High-Speed Optical Module for Data Centers[J]. Study On Optical Communications, 2024, 50(5): 24003001

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    Paper Information

    Category:

    Received: Feb. 7, 2024

    Accepted: --

    Published Online: Oct. 15, 2024

    The Author Email: Xie Liang (xiel@semi.ac.cn)

    DOI:10.13756/j.gtxyj.2024.240030

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