Nano-Micro Letters, Volume. 16, Issue 1, 119(2024)

The Roadmap of 2D Materials and Devices Toward Chips

Anhan Liu1,†... Xiaowei Zhang1,†, Ziyu Liu2,†, Yuning Li5,†, Xueyang Peng4,6,†, Xin Li3,†, Yue Qin3, Chen Hu4,6, Yanqing Qiu4,6, Han Jiang2, Yang Wang2, Yifan Li1, Jun Tang3, Jun Liu3, Hao Guo3,*, Tao Deng5,**, Songang Peng4,7,***, He Tian1,**** and Tian-Ling Ren1,***** |Show fewer author(s)
Author Affiliations
  • 1School of Integrated Circuits and Beijing National Research Center for Information Science and Technology (BNRist), Tsinghua University, Beijing 100049, People’s Republic of China
  • 2School of Microelectronics, Fudan University, Shanghai 200433, People’s Republic of China
  • 3State Key Laboratory of Dynamic Measurement Technology, Shanxi Province Key Laboratory of Quantum Sensing and Precision Measurement, North University of China, Taiyuan 030051, People’s Republic of China
  • 4High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, People’s Republic of China
  • 5School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing 100044, People’s Republic of China
  • 6School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, People’s Republic of China
  • 7IMECAS-HKUST-Joint Laboratory of Microelectronics, Beijing, 100029, People’s Republic of China
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    Anhan Liu, Xiaowei Zhang, Ziyu Liu, Yuning Li, Xueyang Peng, Xin Li, Yue Qin, Chen Hu, Yanqing Qiu, Han Jiang, Yang Wang, Yifan Li, Jun Tang, Jun Liu, Hao Guo, Tao Deng, Songang Peng, He Tian, Tian-Ling Ren. The Roadmap of 2D Materials and Devices Toward Chips[J]. Nano-Micro Letters, 2024, 16(1): 119

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    Paper Information

    Category: Research Articles

    Received: Jun. 30, 2023

    Accepted: Oct. 30, 2023

    Published Online: Jan. 23, 2025

    The Author Email: Guo Hao (guohao@nuc.edu.cn), Deng Tao (dengtao@bjtu.edu.cn), Peng Songang (pengsongang@ime.ac.cn), Tian He (tianhe88@tsinghua.edu.cn), Ren Tian-Ling (RenTL@tsinghua.edu.cn)

    DOI:10.1007/s40820-023-01273-5

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