Nano-Micro Letters, Volume. 16, Issue 1, 119(2024)
The Roadmap of 2D Materials and Devices Toward Chips
Due to the constraints imposed by physical effects and performance degradation, silicon-based chip technology is facing certain limitations in sustaining the advancement of Moore’s law. Two-dimensional (2D) materials have emerged as highly promising candidates for the post-Moore era, offering significant potential in domains such as integrated circuits and next-generation computing. Here, in this review, the progress of 2D semiconductors in process engineering and various electronic applications are summarized. A careful introduction of material synthesis, transistor engineering focused on device configuration, dielectric engineering, contact engineering, and material integration are given first. Then 2D transistors for certain electronic applications including digital and analog circuits, heterogeneous integration chips, and sensing circuits are discussed. Moreover, several promising applications (artificial intelligence chips and quantum chips) based on specific mechanism devices are introduced. Finally, the challenges for 2D materials encountered in achieving circuit-level or system-level applications are analyzed, and potential development pathways or roadmaps are further speculated and outlooked.
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Anhan Liu, Xiaowei Zhang, Ziyu Liu, Yuning Li, Xueyang Peng, Xin Li, Yue Qin, Chen Hu, Yanqing Qiu, Han Jiang, Yang Wang, Yifan Li, Jun Tang, Jun Liu, Hao Guo, Tao Deng, Songang Peng, He Tian, Tian-Ling Ren. The Roadmap of 2D Materials and Devices Toward Chips[J]. Nano-Micro Letters, 2024, 16(1): 119
Category: Research Articles
Received: Jun. 30, 2023
Accepted: Oct. 30, 2023
Published Online: Jan. 23, 2025
The Author Email: Guo Hao (guohao@nuc.edu.cn), Deng Tao (dengtao@bjtu.edu.cn), Peng Songang (pengsongang@ime.ac.cn), Tian He (tianhe88@tsinghua.edu.cn), Ren Tian-Ling (RenTL@tsinghua.edu.cn)