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Microelectronics, Volume. 53, Issue 2, 295(2023)

Research Progress of Flexible Pressure Sensor’s Molding Technologies and Preparation Processes

WU Xupeng1... FANG Yuming1,2, FEI Hongxin1, CAI Teng1, ZHAO Jiang1,2, and LI Ruozhou12 |Show fewer author(s)
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    WU Xupeng, FANG Yuming, FEI Hongxin, CAI Teng, ZHAO Jiang, LI Ruozhou. Research Progress of Flexible Pressure Sensor’s Molding Technologies and Preparation Processes[J]. Microelectronics, 2023, 53(2): 295

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    Received: Apr. 8, 2022

    Accepted: --

    Published Online: Dec. 15, 2023

    The Author Email:

    DOI:10.13911/j.cnki.1004-3365.220126

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology