Optics and Precision Engineering, Volume. 23, Issue 3, 708(2015)
Synergistic bonding process of solvent and tendon for PC-based microfluidic chips
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FAN Jian-hua, DENG Yong-bo, XUAN Ming, LIU Yong-shun, WU Jun-feng, WU Yi-hui. Synergistic bonding process of solvent and tendon for PC-based microfluidic chips[J]. Optics and Precision Engineering, 2015, 23(3): 708
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Received: Jan. 10, 2014
Accepted: --
Published Online: Apr. 20, 2015
The Author Email: Jian-hua FAN (jianhua_fan@163.com)