To form enclosed microchannels in microfluidic chips,a bonding method suitable for a polymer microfluidic chip was proposed to overcome the microstructure collapse of hot bonding and the microwarp of microfluidic chip fabricated by hot embossing and to ensure the subsequent bonding.A PC microfluidic chip was used in the research.The heating pressure method was used to prepare bonding tendons in two sides on microchannels of the microfluidic chip and the chemical solvent acetone was used to dissolve the surface of PC wafer slightly.Then the PC wafer and the microfluidic chip with bonding tendons were fitted,pressured and heated,and the bonding process was implemented.The bonding mechanism was analyzed and the bonding process parameters were also optimized.Experimental results illustrate that dissolving time and bonding temperature influence the bonding quality obviously.The microfluidic chip with acceptable quality is achieved when the bonding temperature is between 80° and 90℃ and the dissolving time is between 35 s and 45 s.Entire bonding process just needs 3 minutes.As compared with traditional process,this bonding process has improved the processing efficiency greatly and it not only can be used for the microfluidic chip with different channel widths,but also is suitable for the microfluidic chips fabricated by other polymers.