Journal of Terahertz Science and Electronic Information Technology , Volume. 18, Issue 5, 939(2020)
Destructive Physical Analysis method of a new Package on Package(PoP) memory
References(3)
[1] [1] HUNG J P,LIN J C,TSAI P H,et al. Interconnect structure for Package-on-Package devices:U.S., Patent,10/269,685[P]. 2019-4-23.
[2] [2] HSU C L,LIU C S,LU D Y,et al. Package on package devices and methods of packaging semiconductor dies:U.S., Patent 8,981,559[P]. 2015-3-17.
[5] [5] SU Y F,CHIANG K N,LIANG S Y. Design and reliability assessment of novel 3D-IC packaging[J]. Journal of Mechanics, 2017,33(2):193-203.
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ZHOU Shuai, WENG Zhangzhao, WANG Bin, LUO Zhongtao. Destructive Physical Analysis method of a new Package on Package(PoP) memory[J]. Journal of Terahertz Science and Electronic Information Technology , 2020, 18(5): 939
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Received: Jul. 19, 2019
Accepted: --
Published Online: Jan. 22, 2021
The Author Email: Shuai ZHOU (232264594@qq.com)
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