Bulletin of the Chinese Ceramic Society, Volume. 41, Issue 5, 1797(2022)
Simulation Study on Effect of Defects on Thermal Conductivity of Silicon Nitride
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CHEN Daye, CHEN Peng, QIAN Jiasheng, XIA Ru, WU Bin. Simulation Study on Effect of Defects on Thermal Conductivity of Silicon Nitride[J]. Bulletin of the Chinese Ceramic Society, 2022, 41(5): 1797
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Received: Jan. 11, 2022
Accepted: --
Published Online: Jul. 21, 2022
The Author Email: Daye CHEN (c-18855806820@163.com)
CSTR:32186.14.
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