Journal of Inorganic Materials, Volume. 36, Issue 8, 847(2020)

Effect and Mechanism of the Surface Treatment and Gradation Filling of AlN on the Performance of Insulation Layer of Copper Clad Laminate

Weiwei ZHANG1... Chen LU1, Guobing YING1, Jianfeng ZHANG1,* and Wan JIANG2 |Show fewer author(s)
Author Affiliations
  • 11. College of Mechanics of Materials, Hohai University, Nanjing 211100, China
  • 22. College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
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    References(31)

    [13] Y YANG, M GAO J, T LEI et al. Thermal conductivity and mechanical properties of polyimide composites with mixed fillers of BN flakes and SiC@SiO2 whiskers. Polymer Engineering & Science, 60, 1044-1053(2020).

    [16] P HE D, H GAO, J ZHANG J et al. Simulation and experimental verification of thermal property for aluminum nitrides and copper clad laminates under space thermal environment. Journal of Inorganic Materials, 34, 947-952(2019).

    [21] W ZHANG W, C LU, N GE M et al. Surface modified and gradation-mixed Al2O3 as an effective filler for the polyphenylene oxide (PPO) insulative layer in copper clad laminates. Journal of Materials Science: Materials in Electronics(2020).

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    Weiwei ZHANG, Chen LU, Guobing YING, Jianfeng ZHANG, Wan JIANG. Effect and Mechanism of the Surface Treatment and Gradation Filling of AlN on the Performance of Insulation Layer of Copper Clad Laminate[J]. Journal of Inorganic Materials, 2020, 36(8): 847

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    Paper Information

    Category: RESEARCH ARTICLE

    Received: Nov. 9, 2020

    Accepted: --

    Published Online: Dec. 8, 2021

    The Author Email: ZHANG Jianfeng (jfzhang_sic@163.com)

    DOI:10.15541/jim20200639

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