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Optics and Precision Engineering, Volume. 18, Issue 3, 552(2010)

Smile effect and package technique for diode laser arrays

WANG Xiang-peng1...2,*, LI Zai-jin1,2, LIU Yun1 and WANG Li-jun1 |Show fewer author(s)
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  • 1[in Chinese]
  • 2[in Chinese]
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    WANG Xiang-peng, LI Zai-jin, LIU Yun, WANG Li-jun. Smile effect and package technique for diode laser arrays[J]. Optics and Precision Engineering, 2010, 18(3): 552

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    Paper Information

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    Received: Mar. 23, 2009

    Accepted: --

    Published Online: Aug. 31, 2010

    The Author Email: Xiang-peng WANG (wangxp361@163.com)

    DOI:

    CSTR:32186.14.

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology