Photonics Research, Volume. 8, Issue 5, 755(2020)

High-performance mid-wavelength InAs avalanche photodiode using AlAs0.13Sb0.87 as the multiplication layer

Jianliang Huang1,2, Chengcheng Zhao1,2, Biying Nie1,2, Shiyu Xie3,4、*, Dominic C. M. Kwan3, Xiao Meng3, Yanhua Zhang1,2, Diana L. Huffaker3, and Wenquan Ma1,2,5、*
Author Affiliations
  • 1Key Laboratory of Semiconductor Materials Science, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
  • 2Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
  • 3School of Physics and Astronomy, Cardiff University, Cardiff, UK
  • 4e-mail: XieS1@cardiff.ac.uk
  • 5e-mail: wqma@semi.ac.cn
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    Figures & Tables(7)
    (a) C-V measured at room temperature with the fitting. The device size is 400 μm×400 μm. (b) Simulated electric field distribution at different bias voltages. (c) Simulated avalanche gain with respect to the reverse bias voltage.
    (a) Dark current curves of a device with a mesa area of 400 μm×400 μm for the temperature range from 77 to 300 K. (b) Measured dark current together with the band-to-band tunneling current and the simulated dark current for the bias voltage between 10.5 and 18 V.
    (a) Arrhenius plot of the dark current for the temperature range between 77 and 275 K. (b) Activation energy versus the forward bias voltage. (c) Dependence of the (1/R0A)−1 on the (p/A)−1 for different mesa sizes at room temperature.
    Measured responsivity under different bias voltages at room temperature. The responsivity of the reference device is also shown.
    Avalanche gain with respect to the reverse bias voltage. The inset is the responsivity with respect to the reverse bias voltage for different wavelengths.
    (a) Measured NEP of the device with respect to wavelength at different reverse bias voltages with the inset showing the measured noise current. (b) The corresponding D⋆ with respect to wavelength. The device size is 400 μm×400 μm.
    • Table 1. Details of the Device Structure

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      Table 1. Details of the Device Structure

      MaterialDesignModelled
      Thickness (μm)Doping (cm3)Thickness (μm)Doping (cm3)
      InAs0.52.0 × 1018(p)/2.0 × 1018
      InAs2.0Undoped2.01.5 × 1016
      AlAsSb0.5Undoped0.51.5 × 1016
      InAs0.82.0 × 1018(n)/2.0 × 1018
      N+ InAs substrate
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    Jianliang Huang, Chengcheng Zhao, Biying Nie, Shiyu Xie, Dominic C. M. Kwan, Xiao Meng, Yanhua Zhang, Diana L. Huffaker, Wenquan Ma. High-performance mid-wavelength InAs avalanche photodiode using AlAs0.13Sb0.87 as the multiplication layer[J]. Photonics Research, 2020, 8(5): 755

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    Paper Information

    Category: Optoelectronics

    Received: Dec. 4, 2019

    Accepted: Feb. 22, 2020

    Published Online: Apr. 26, 2020

    The Author Email: Shiyu Xie (XieS1@cardiff.ac.uk), Wenquan Ma (wqma@semi.ac.cn)

    DOI:10.1364/PRJ.385177

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