Fig. 1. Schematic diagram of oblique sputtering for preparing magnetic films (HA, hard axis).

Fig. 2. The MFM images of (a) 105 nm, (b) 210 nm and (c) 262 nm-thick Ni₈₈Cu₁₂ films before heat treatment; (d) in-plane normalized hysteresis loop of Ni₈₈Cu₁₂; (e) remanence ratio vs. film thickness.

Fig. 3. (a) XRD pattern of 105 nm-thick Ni₈₈Cu₁₂ film before and after heat treatment; the SEM surface morphology of 105 nm-thick Ni₈₈Cu₁₂ films (b) before heat treatment, (c) after 300 ºC heat treatment, and (d) after 400 ºC heat treatment.

Fig. 4. (a) In-plane normalized hysteresis loop of 105 nm-thick Ni₈₈Cu₁₂ film before and after heat treatment; The MFM images of 105 nm-thick Ni₈₈Cu₁₂ films (b) before heat treatment, (c) after 300 ºC heat treatment, and (d) after 400 ºC heat treatment.

Fig. 5. Permeability spectra of 105 nm-thick Ni₈₈Cu₁₂ film before and after heat treatment.