Optics and Precision Engineering, Volume. 17, Issue 7, 1587(2009)
Chemical mechanical polishing for silicon wafer by composite abrasive slurry
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XU Xue-feng, MA Bing-xun, HUANG Yi-shen, PENG Wei. Chemical mechanical polishing for silicon wafer by composite abrasive slurry[J]. Optics and Precision Engineering, 2009, 17(7): 1587
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Received: Aug. 5, 2008
Accepted: --
Published Online: Oct. 28, 2009
The Author Email: Xue-feng XU (xuxuefeng@zjut.edu.cn)
CSTR:32186.14.
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