Journal of Inorganic Materials, Volume. 38, Issue 2, 113(2023)

Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend

Yan LIU*... Keying ZHANG, Tianyu LI, Bo ZHOU, Xuejian LIU and Zhengren HUANG |Show fewer author(s)
Figures & Tables(20)
Joining technology of ceramics and their applications[13]
Equipment and mechanism of FDB [25-26]
Interfacial SEM micrographs of manganese-zinc ferrite poly- and single-crystals under different bonding conditions[25]
Cross-sectional microstructures at the Ni/ZrO2 interfaces after joining under different current intensities and polarities[33]
TEM micrographs of the Al2O3/Ti joint bonded at 900 ℃ for 1 h under 700 V DC field [34]
Working schematic of an SPS apparatus[38]
Fractured micrographs of the TaC-HfC joint [44]
Backscattered SEM images of the polished cross section of the CVD β-SiC joined with the pre-sintered Ti3SiC2 foil using SPS[46]
Microstructures of CVD-SiC/Ti/Nb/Ti/CVD-SiC joint[49]
Schematic diagram and performance of flash joining[24]
Schematic diagrams of interfacial microstructure evolution of 3YSZ/Ag-CuO/430SS assembly[69]
SEM images of 3YSZ joint[24]
Shear strength of the 3YSZ/Ti-alloy joint under different conditions[74]
  • Table 1. Comparison of three electric-field assisted joining technologies

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    Table 1. Comparison of three electric-field assisted joining technologies

    Joining methodElectric field typeElectric fieldJoining currentJoining temperatureJoining time
    FDBDCSmallSmallLowLong
    SPSDC pulseSmallLargeHighShort
    FJDC/DC pulseLargeSmallLowFast
  • Table 2. FDB of ionic conductive ceramics

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    Table 2. FDB of ionic conductive ceramics

    Joining systemJoining conditionShear strength/MPaMain phases at interfaceRef.
    Al/β-Al2O3500-600 ℃, 500 V, 1-2 hNo interlayer[27]
    Cu/ZrO2800 ℃ 50 V, 1 A, 20 minCu2O, Cu-Zr[32]
    Ni/ZrO21100 ℃, 10 mA, 30 min160±15Ni-Zr[33]
    Polycrystal ferrites/single crystalline ferrites1200 ℃, 1 A, 24 hNo interlayer[25]
  • Table 3. SPS joining of ceramic material without interlayer

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    Table 3. SPS joining of ceramic material without interlayer

    Joining systemJoining conditionsJoint strengthcharacterization Maximum averagejoint strength/MPa Ref.
    SiC/SiC1900 ℃, 5 min, 3.5 MPaBending strength260.24±12.00[20]
    LR-SiC/LR-SiC1750 ℃, ~500 ℃/min, 800 A, 10 min, 50 MPa[39]
    HR-SiC/HR-SiC2100 ℃, 100 ℃/min, 2400 A, 10 min, 50 MPa[39]
    CVD-SiC/CVD-SiC1900 ℃, 50 ℃/min, 5 min, 60 MPaBending strength436±1[22]
    Coated C/SiC/C/SiC1700 ℃, 150-200 ℃/min, 3 min, 60 MPaShear strength24.6[40]
    Ti3SiC2/Ti3AlC21200 ℃, 150 ℃/min, ~1.18 kA, <6 min, 15 MPaShear strength~50[41]
    Ti3SiC2/Ti3SiC21300 ℃, 150 ℃/min, ~1.30 kA, <6 min, 15 MPaShear strength~50[41]
    Ti3AlC2/Ti3AlC21300 ℃, 150 ℃/min, ~1.32 kA, <6 min, 15 MPaShear strength~60[41]
    SiCw/Ti3SiC2/SiCw/Ti3SiC21090 ℃, 100 ℃/min, 586 A·cm-2, 30 s, 30 MPaShear strength51.8±2.9[42]
    STO bicrystal/STO bicrystal1200 ℃, 70-80 ℃/min, ~550 A, 15 min, 140 MPa[43]
    TaC/HfC1850 ℃, 10 min, 60 MPa[44]
    α-SiAlON/α-SiAlON1650 ℃, 10 min, 20 MPaBending strength~610[45]
  • Table 4. SPS joining of ceramic material with inorganic material interlayer

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    Table 4. SPS joining of ceramic material with inorganic material interlayer

    Joining systemInterlayerJoining conditionsJoint strengthcharacterization Maximum joint strength/MPaMain phases at interface Ref.
    SiC/SiC4.5YSZ1700 ℃, 150 ℃/min, 40 MPaBending strength26.7ZrO2[47]
    SiC/SiC4.5YSZ+20% Al2O3 (in mass)1800 ℃, 100-200 ℃/min, 40 MPaBending strength107.3ZrO2, mZrO2[47]
    SiC/SiCTSC1900 ℃, 5 min, 3.5 MPaBending strength230.6±19TiC, Ti, Al[20]
    SiC/SiCTAC1900 ℃, 5 min, 3.5 MPaBending strength230.5±13TiC, Al, Ti[20]
    SiC/SiCTSC1300 ℃, 100-200 ℃/min, 15 min, 50 MPaBending strength80.4TiCx, TixSiy[23]
    SiC/SiCTSC1400 ℃, 100-200 ℃/min, 30 MPaBending strength66TiSi2, TiC[48]
    SiC/SiCTSC1600 ℃, 30 min, 20-40 MPaBending strength110.4TSC, TiC[19]
    CVD-SiC/CVD-SiCTSC1300 ℃, 100 ℃/min, 5 min, 50 MPaBending strength220.3±3.2TSC[46]
    Coated SiCf/SiC/coated SiCf/SiCTSC1300 ℃, 100 ℃/min, 5 min, 50 MPaShear strength18.3±5.8TSC[21]
    Coated Cf/SiC/coated Cf/SiCTSC1300 ℃, 100 ℃/min, 5 min, 50 MPaShear strength31.1±4.0TSC[21]
    Uncoated T300 1K Cf/SiC/uncoated T300 1K Cf/SiCTSC1300 ℃, 100 ℃/min, 5 min, 50 MPaShear strength19.1±2.0TSC, SiC[21]
    Uncoated M40J 3K Cf/SiC/uncoated M40J 3K Cf/SiCTSC1300 ℃, 100 ℃/min, 5 min, 50 MPaShear strength5.5±1.8TSC, SiC[21]
    Coated C/SiC/coated C/SiCCA1480 ℃, 50 ℃/min, 10 min, 0 MPaShear strength~14.1CA[40]
    Coated C/SiC/coated C/SiCSiC+B4C1900 ℃, 150-200 ℃/min, 3 min, 60 MPaShear strength18.2[40]
    Cf/SiC/Cf/SiCTSC1600 ℃, 30 min, 20-40 MPaBending strength62.6TSC, TiC[19]
  • Table 5. SPS joining of ceramic material with metal interlayer

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    Table 5. SPS joining of ceramic material with metal interlayer

    Joining systemInterlayerJoining conditionsJoint strengthcharacterization Maximum joint strength/MPaMain phases at interfaceRef.
    SiC/SiCY1900 ℃, 100 ℃/min, 10 min, 50 MPaBending strength134.8±2.1ZrO2[50]
    SiC/SiCTi1000 ℃, 100 ℃/min, 5 min, 30 MPaBending strength205.7±24ZrO2, mZrO2[51]
    SiC/SiC3Ti/1.2Si/2C/0.2Al1600 ℃, 100-200 ℃/min, 30 MPaBending strength133TiC, Ti, Al[48]
    SiC coated C/SiC/ SiC coated C/SiCTi/Nb/Ti1200 ℃, 100 ℃/min, 5 min, 50 MPaShear strength61±6TiC, Al, Ti[49]
    CVD-SiC/CVD-SiCTi1700 ℃, 50 ℃/min, 5 min, 60 MPaBending strength126±16TiCx, TixSiy[22]
    Coated C/SiC/coated C/SiCTi1700 ℃, 150-200 ℃/min, 3 min, 60 MPaShear strength17.3±7.8TiSi2, TiC[40]
  • Table 6. Flash joining between ceramics

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    Table 6. Flash joining between ceramics

    Joining systemJoining conditionsJoint strengthcharacterization Maximum averagejoint strength/MPa Ref.
    3YSZ/3YSZ900 ℃, 30 V/cm, 100 mA/mm2, 6 MPa, 1 sBending strength595[24]
    CVD-SiC/Ti/Cf/SiC1250 ℃, 2.2 kW, 370 A, 16 MPa, 7 sShear strength31.4[65]
    3YSZ/3YSZ800 ℃, 50 V/cm, 100 mA/mm2, 6 MPa, 18 sBending strength606±18[70]
    MgO-doped Al2O3/MgO-doped Al2O31300 ℃, 1500 V/cm, 0.1 A, 4 MPa, 30 sShear strength146[71]
    BSCF/BSCF1000 ℃, 10 V/cm, 0.45 A/mm2, 10 s[72]
    ZrO2/ZA/Al2O31200 ℃, 1800 V/cm, 0.3 A, 4 MPa, 30 sShear strength3YSZ/ZA: ~65ZA/Al2O3: ~30[73]
  • Table 7. Flash joining between ceramics and metals

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    Table 7. Flash joining between ceramics and metals

    Joining systemJoining conditionsJoint strengthcharacterization Maximum joint strength/MPaMain phases at interfaceRef.
    ZrO2/Ti-alloy700 ℃, 100 V/cm, 70 mA/mm2, 30 s,10 MPaShear strength67±9Ti, Zr[74]
    ZrO2/Ni-alloy800 ℃, 100 V/cm, 100 mA/mm2, 1 s, 5 MPaShear strength133Ni, Zr[75]
    3YSZ/Ag-CuO/430SS950 ℃, 80 V/cm, 40 mA/mm2, 30 s, 0.7 MPaShear strength158±9AgCu4Zr[69]
    3YSZ/Cu/304SS1200 ℃, 50 V/cm, 100 mA/mm2, 30 s, 6 MPaShear strength21±4Cu-Zr[76]
    3YSZ/Cu/GH31281000 ℃, 30 mA/mm2, 30 s, 0.1 MPaShear strength250±15Cu-Zr[77]
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Yan LIU, Keying ZHANG, Tianyu LI, Bo ZHOU, Xuejian LIU, Zhengren HUANG. Electric-field Assisted Joining Technology for the Ceramics Materials: Current Status and Development Trend[J]. Journal of Inorganic Materials, 2023, 38(2): 113

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Paper Information

Category: EDITORIAL

Received: Jul. 9, 2022

Accepted: --

Published Online: Sep. 27, 2023

The Author Email: LIU Yan (stony2000@mail.sic.ac.cn)

DOI:10.15541/jim20220400

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