Acta Photonica Sinica, Volume. 39, Issue 4, 643(2010)

Thermal-stress Analysis of the Adhesive Bonding Between the Planar Optical Waveguides Based on Finite Element Method

XU Zhou-long and ZHENG Yu*
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    XU Zhou-long, ZHENG Yu. Thermal-stress Analysis of the Adhesive Bonding Between the Planar Optical Waveguides Based on Finite Element Method[J]. Acta Photonica Sinica, 2010, 39(4): 643

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    Paper Information

    Received: Jun. 18, 2009

    Accepted: --

    Published Online: May. 24, 2010

    The Author Email: Yu ZHENG (zhengyu@mail.csu.edu.cn)

    DOI:

    CSTR:32186.14.

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