Acta Optica Sinica (Online), Volume. 1, Issue 6, 0602002(2024)
Silicon Based Optoelectronics and Its Frontier Advances (Invited)
Fig. 3. Metamaterial mode division multiplexer with gradient refractive index [59]. (a) 16 channel configuration schematic of MUX mode; (b) microscope image; (c) SEM image; (d)‒(f) SEM images of coupling region
Fig. 4. 192-channel on-chip reconfigurable optical add-drop multiplexer (ROADM) [60]. (a) Microscopic image of ROADM; (b) enlarged schematic of the mode/polarization (de)multiplexer; (c) wavelength-selective optical switch; (d) enlarged schematic of the tunable optical attenuator
Fig. 5. Monolithically integrated silicon-based quantum dot laser[64]. (a) Schematic of monolithic integration of Ⅲ‒V QD laser edge-coupled silicon waveguide on a SOI platform; (b) top-view SEM image of InAs QD laser array; (c) optical microscope image of integrated chip; (d) 8 inch (1 inch=2.54 cm) SOI wafer and pre-patterned laser trenches and silicon waveguides; (e) microscope image of laser trench aligned with silicon waveguide array; (f) SEM image of silicon grating structure in laser trench; (g) enlarged image of grating
Fig. 6. InP-on-Si laser[43]. (a) Schematic of the process for fabricating InP-on-Si by ion cutting; (b) wafer-level patterned laser devices based on InP-on-Si substrates; (c) SEM image of cross-section of the laser
Fig. 8. Silicon-based photodetector[73-74]. (a) Interface diagram of 80 GHz germanium photodiode detector; (b) electron microscope image of detector; (c) bandwidth characteristic; (d) germanium/silicon avalanche photodiode with 1 THz gain‒bandwidth product; (e) two-dimensional section of junction area; (f) electric field distribution in Ge and Si regions under different gaps; (g) different methods for optimizing APD performance; (h) simulated bandwidth and corresponding GBP under different Lp when the gain is 20; (i) microscope image of the fabricated APD
Fig. 9. Monolithically integrated chip[16,45]. (a) Schematic of cross-sectional view of monolithic integration process; (b) digital circuit area; (c) monolithic integration area of digital, analog, and optoelectronic modules; (d) scanning electron microscope characterization diagram of multi-thickness areas of optoelectronic device film layers; (e) (f) monolithic integration PD, MMR modulator, filter, TIA, and thermal tuning module to realize optical transmission and reception functions
Fig. 11. The first silicon-based integrated 100 Gbit/s coherent receiving and transmission chip in China[76]
Fig. 12. oNOC optoelectronic hybrid chip produced by Lightelligence[21]
Fig. 14. 9216-channel lidar system[85]. (a) Lidar system diagram; (b) lidar engine chip; (c) schematic of optical phased array chip; (d) (e) pin diagrams of CMOS driver chip
Fig. 15. Lidar transmitter chip based on multilayer Si3N4-SOI platform[86]. (a) Schematic of transmitter; (b) chip packaging diagram
Fig. 16. Ultra-low power silicon-based electro-optic modulator for large-scale neural interfaces[90]. (a) Photovoltaic modulator; (b) device layout; (c) DC transmission spectrum; (d) frequency response of the modulator; (e)‒(g) optical signal transmission diagrams under different drivings
Fig. 18. Photonic tensor core for in-memory computing using continuous-time data representation[96]
|
Get Citation
Copy Citation Text
Zhiping Zhou, Weibiao Chen, Junbo Feng, Fenghe Yang, Deyue Ma, Xiwen He, Dezhao Li, Huihuang Hou, Youqiang Shuai, Weilong Cui. Silicon Based Optoelectronics and Its Frontier Advances (Invited)[J]. Acta Optica Sinica (Online), 2024, 1(6): 0602002
Category: Research Articles
Received: Oct. 13, 2024
Accepted: Nov. 28, 2024
Published Online: Dec. 18, 2024
The Author Email: Zhou Zhiping (zjzhou@pku.edu.cn)
CSTR:32394.14.AOSOL240458