Chinese Journal of Quantum Electronics, Volume. 22, Issue 4, 482(2005)

Thermal effect analysis in the process of high power frequency doubling

[in Chinese]1、* and [in Chinese]2
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    [in Chinese], [in Chinese]. Thermal effect analysis in the process of high power frequency doubling[J]. Chinese Journal of Quantum Electronics, 2005, 22(4): 482

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    Paper Information

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    Received: Jun. 28, 2005

    Accepted: --

    Published Online: May. 15, 2006

    The Author Email: (jqyao@tju.edu.cn)

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