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Chip, Volume. 3, Issue 4, 100107(2024)

A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors

Xinyu Wang1,†... Die Wang1,†, Yuchen Tian1,†, Jing Guo1, Jinshui Miao2,*, Weida Hu2, Hailu Wang2, Kang Liu1, Lei Shao3,**, Saifei Gou1, Xiangqi Dong1, Hesheng Su1, Chuming Sheng1, Yuxuan Zhu1, Zhejia Zhang1, Jinshu Zhang1, Qicheng Sun1, Zihan Xu4, Peng Zhou1,5, Honglei Chen2,***, and Wenzhong Bao15,**** |Show fewer author(s)
Author Affiliations
  • 1State Key Laboratory of Integrated Chips and Systems, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
  • 2State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 3School of Electronic Information, Soochow University, Suzhou 215006, China
  • 4Shenzhen Six Carbon Technology, Shenzhen 518055, China
  • 5Shaoxin Laboratory, Shaoxing 312000, China
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    Xinyu Wang, Die Wang, Yuchen Tian, Jing Guo, Jinshui Miao, Weida Hu, Hailu Wang, Kang Liu, Lei Shao, Saifei Gou, Xiangqi Dong, Hesheng Su, Chuming Sheng, Yuxuan Zhu, Zhejia Zhang, Jinshu Zhang, Qicheng Sun, Zihan Xu, Peng Zhou, Honglei Chen, Wenzhong Bao. A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors[J]. Chip, 2024, 3(4): 100107

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    Paper Information

    Category: Research Articles

    Received: Apr. 28, 2024

    Accepted: Aug. 4, 2024

    Published Online: Jan. 23, 2025

    The Author Email: Miao Jinshui (jsmiao@mail.sitp.ac.cn), Shao Lei (shaolei@suda.edu.cn), Chen Honglei (chenhl@mail.sitp.ac.cn), Bao Wenzhong (baowz@fudan.edu.cn)

    DOI:10.1016/j.chip.2024.100107

    Topics

    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology