Chip, Volume. 3, Issue 4, 100107(2024)

A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors

Xinyu Wang1,†... Die Wang1,†, Yuchen Tian1,†, Jing Guo1, Jinshui Miao2,*, Weida Hu2, Hailu Wang2, Kang Liu1, Lei Shao3,**, Saifei Gou1, Xiangqi Dong1, Hesheng Su1, Chuming Sheng1, Yuxuan Zhu1, Zhejia Zhang1, Jinshu Zhang1, Qicheng Sun1, Zihan Xu4, Peng Zhou1,5, Honglei Chen2,***, and Wenzhong Bao15,**** |Show fewer author(s)
Author Affiliations
  • 1State Key Laboratory of Integrated Chips and Systems, School of Microelectronics, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai 200433, China
  • 2State Key Laboratory of Infrared Physics, Shanghai Institute of Technical Physics, Chinese Academy of Sciences, Shanghai 200083, China
  • 3School of Electronic Information, Soochow University, Suzhou 215006, China
  • 4Shenzhen Six Carbon Technology, Shenzhen 518055, China
  • 5Shaoxin Laboratory, Shaoxing 312000, China
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    Photodetectors (PDs) are crucial in modern society as they enable the detection of a diverse range of light-based signals. With the exponential increase in their development, materials are being used to create a wide range of PDs that play critical roles in enabling various applications and technologies. Image sensor technology has been hindered due to the lack of a universal system that can integrate all types of PDs with silicon-based readout integrated circuits (ROICs). To address this issue, we conducted experiments adopting two-dimensional materials as an example. High-performance MoS2-/MoTe2-based PDs were fabricated in the current work and the most suitable ROICs were identified to pair with them. This established a solid foundation for further researches in the field of image sensors. We developed and implemented a versatile testing system that uses a printed circuit board to connect the PD and ROIC. After the ROIC generates the sampled signal, it is collected and processed by algorithms, which overcome device uniformity limitations and produce a high-quality image that is visible to the naked eye. This universal system can be used with a wide range of PD and ROIC types made from different materials, making it highly convenient for diverse testing applications and the development of diverse image sensor types. This robust new platform is expected to spur further innovation and advancements in this rapidly developing field.

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    Xinyu Wang, Die Wang, Yuchen Tian, Jing Guo, Jinshui Miao, Weida Hu, Hailu Wang, Kang Liu, Lei Shao, Saifei Gou, Xiangqi Dong, Hesheng Su, Chuming Sheng, Yuxuan Zhu, Zhejia Zhang, Jinshu Zhang, Qicheng Sun, Zihan Xu, Peng Zhou, Honglei Chen, Wenzhong Bao. A universal optoelectronic imaging platform with wafer-scale integration of two-dimensional semiconductors[J]. Chip, 2024, 3(4): 100107

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    Paper Information

    Category: Research Articles

    Received: Apr. 28, 2024

    Accepted: Aug. 4, 2024

    Published Online: Jan. 23, 2025

    The Author Email: Miao Jinshui (jsmiao@mail.sitp.ac.cn), Shao Lei (shaolei@suda.edu.cn), Chen Honglei (chenhl@mail.sitp.ac.cn), Bao Wenzhong (baowz@fudan.edu.cn)

    DOI:10.1016/j.chip.2024.100107

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