Infrared and Laser Engineering, Volume. 46, Issue 11, 1103004(2017)
Full-field measurement of micro strain of printed circuit board assembly using digital image correlation
Figures & Tables(0)
Tools
Get Citation
Copy Citation Text
Yang Jing, Wu Sijin, Zheng Weiwei, Li Weixian, Yang Lianxiang. Full-field measurement of micro strain of printed circuit board assembly using digital image correlation[J]. Infrared and Laser Engineering, 2017, 46(11): 1103004
Paper Information
Category: 特约专栏-野超分辨成像技术
Received: Oct. 10, 2017
Accepted: Nov. 20, 2017
Published Online: Dec. 26, 2017
The Author Email: Jing Yang (yangjing139kl@163.com)
© Copyright 2018-2021 | Chinese Laser Press.
All Rights Reserved 沪ICP备15018463号-20