Effect of retaining ring on pressure distribution and profile of polishing wafer surface

[in Chinese]; [in Chinese]; [in Chinese]; [in Chinese]

Optics and Precision Engineering, Volume. 16, Issue 4, 689(2008)

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References(6)

[1] [1] SRINIVASA-MURTHY C,WANG D,BEAUDOIN S P,et al..Stress distribution in chemical-mechanical polishing[J].Thin Solid Film,1997,308:533-537.

[2] [2] LUO J F,DORNFELD D A.Material removal mechanism in chemical mechanical polishing:theory and modeling[J].IEEE Transactions on Semiconductor Manufacturing,2001.14(2):112-133.

[4] [4] CAI G Q,LU Y S,ZHENG H W.Pressure distribution of lapping and polishing[J].Annals of the CIRP,1998,47(1):235-238.

[5] [5] PRESTON F W.The theory and design of plate class polishing machine[J].J.Soc.Glass Technol,1927,11:214-256.

[7] [7] LI H,DEMPSEY J P.Axisymmetric indentation of an elastic layer underlain by rigid base[J].International Journal for Numerical Methods of Engineering,1990,29:57-72.

[9] [9] SAEED M.Finite Element Analysis Theory and Application With ANSYS[M].Peckingt Publishing House of Electronics Industry,2003.

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[in Chinese], [in Chinese], [in Chinese], [in Chinese]. Effect of retaining ring on pressure distribution and profile of polishing wafer surface[J]. Optics and Precision Engineering, 2008, 16(4): 689

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