Optics and Precision Engineering, Volume. 16, Issue 4, 689(2008)

Effect of retaining ring on pressure distribution and profile of polishing wafer surface

[in Chinese]... [in Chinese], [in Chinese] and [in Chinese] |Show fewer author(s)
Author Affiliations
  • [in Chinese]
  • show less
    Tools

    Get Citation

    Copy Citation Text

    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Effect of retaining ring on pressure distribution and profile of polishing wafer surface[J]. Optics and Precision Engineering, 2008, 16(4): 689

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category:

    Received: Oct. 29, 2007

    Accepted: --

    Published Online: Aug. 17, 2008

    The Author Email:

    DOI:

    Topics