The on-chip thermoelectric cooler: advances, applications and challenges

Chengjun Li; Yubo Luo; Wang Li; Boyu Yang; Chengwei Sun; Wenyuan Ma; Zheng Ma; Yingchao Wei; Xin Li; Junyou Yang

doi:10.1016/j.chip.2024.100096

Chip, Volume. 3, Issue 2, 100096(2024)

The on-chip thermoelectric cooler: advances, applications and challenges

Chengjun Li... Yubo Luo*, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li and Junyou Yang** |Show fewer author(s)

Author Affiliations

State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China

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Chengjun Li, Yubo Luo, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li, Junyou Yang. The on-chip thermoelectric cooler: advances, applications and challenges[J]. Chip, 2024, 3(2): 100096

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Paper Information

Category: Research Articles

Received: Dec. 7, 2023

Accepted: Apr. 12, 2024

Published Online: Jan. 23, 2025

The Author Email: Luo Yubo (luoyubo@hust.edu.cn), Yang Junyou (jyyang@mail.hust.edu.cn)

DOI:10.1016/j.chip.2024.100096

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laser devices and laser physics

Lasers and Laser Optics

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