Chip, Volume. 3, Issue 2, 100096(2024)

The on-chip thermoelectric cooler: advances, applications and challenges

Chengjun Li... Yubo Luo*, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li and Junyou Yang** |Show fewer author(s)
Author Affiliations
  • State Key Laboratory of Materials Processing and Die & Mould Technology, School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
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    References(114)

    [50] [50] P. Wang.

    [113] [113] 2023-2029 Global and China Peltier Cooling Modules Market Status and Forecast. Beijing Hengzhou Bozhi International Information Consulting Co., Ltd.

    [114] [114] Thermoelectric (Topic) and Chip (Topic). Web of Science.

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    Chengjun Li, Yubo Luo, Wang Li, Boyu Yang, Chengwei Sun, Wenyuan Ma, Zheng Ma, Yingchao Wei, Xin Li, Junyou Yang. The on-chip thermoelectric cooler: advances, applications and challenges[J]. Chip, 2024, 3(2): 100096

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    Paper Information

    Category: Research Articles

    Received: Dec. 7, 2023

    Accepted: Apr. 12, 2024

    Published Online: Jan. 23, 2025

    The Author Email: Luo Yubo (luoyubo@hust.edu.cn), Yang Junyou (jyyang@mail.hust.edu.cn)

    DOI:10.1016/j.chip.2024.100096

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