Infrared and Laser Engineering, Volume. 52, Issue 4, 20220514(2023)

Simulation and test of optical fiber characteristics in flexible electro-optical printed circuit board process

Jiubing Mao1, Yuanxing Guo1, Yulai She2、*, Qiang Liu1, Junhua Zhang2, Wei Yang1, Jian Yang1, and Quanying Li1
Author Affiliations
  • 1The 30th Research Institute of China Electronics Technology Group Corporation, Chengdu 610093, China
  • 2Mechanical and Electrical Engineering College, Guilin University of Electronic Technology, Guilin 541004, China
  • show less
    Figures & Tables(20)
    (a) Structure diagram of uncoated optical fibers embedding; (b) Structure diagram of coated optical fibers embedding
    The global view of meshing of coated optical fibers embedding in flexible substrate
    Lamination process of circuit board
    Curves of lamination process
    (a) Stress distribution of uncoated optical fibers; (b) Stress distribution of coated optical fibers; (c) Stress distribution of coatings
    The influence of the thickness of the middle PI layer on optical fibers stress
    The influence of thickness of optical fiber bottom filler on optical fibers stress
    Cross-section diagram of optical fiber positioning groove
    (a) Physical picture of FEOPCB; (b) Cross-section diagram of FEOPCB
    Measurement diagram of buried optical fiber offset
    Bending fatigue test of FEOPCB
    Cross-section diagram of FEOPCB bending area
    Schematic diagram of bending loss test
    Bending loss versus curvature radius
    Crosstalk test diagram of adjacent optical fibers
    Schematic diagram of high-speed signal transmission performance test for FEOPCB
    Physical picture of high-speed signal transmission performance test for FEOPCB
    • Table 1. Properties of materials

      View table
      View in Article

      Table 1. Properties of materials

      MaterialElastic modulus/GPa Poisson's ratio Thermal expansion coefficient/℃ Density/ kg∙m−3Heat capacity/ J∙(Kg∙℃)−1Thermal conductivity/ W∙(m∙℃)−1
      Copper layer1100.3318×10−68940384398
      Protective layer3.200.3622×10−6142010900.12
      Silica fiber71.90.160.55×10−622007451.50
      Filled resin7.840.3027×10−697016000.21
      Coating layer3.200.3622×10−6142010900.12
    • Table 2. Measurement results of structural parameters of optical fiber positioning groove

      View table
      View in Article

      Table 2. Measurement results of structural parameters of optical fiber positioning groove

      Measurement itemMeasurement value/μmDesign value/μmError value/μm
      Fpw (copper layer) 155.951550.95
      Fpw (position 1) 155.781550.78
      Fpw (position 2) 140.88155−14.12
      Pitch (P) 244.87250−5.13
      Depth (H) 118.29120−1.71
    • Table 3. Measurement values of buried optical fiber offset

      View table
      View in Article

      Table 3. Measurement values of buried optical fiber offset

      Path number Section number Lateral offset/μm Vertical offset/μm
      1A2.987.15
      D3.876.94
      2A−0.566.26
      D−1.245.74
      3A0.895.70
      D0.666.07
      4A−2.586.84
      D2.276.71
    Tools

    Get Citation

    Copy Citation Text

    Jiubing Mao, Yuanxing Guo, Yulai She, Qiang Liu, Junhua Zhang, Wei Yang, Jian Yang, Quanying Li. Simulation and test of optical fiber characteristics in flexible electro-optical printed circuit board process[J]. Infrared and Laser Engineering, 2023, 52(4): 20220514

    Download Citation

    EndNote(RIS)BibTexPlain Text
    Save article for my favorites
    Paper Information

    Category: Optical communication and sensing

    Received: Jul. 26, 2022

    Accepted: --

    Published Online: Jul. 4, 2023

    The Author Email: She Yulai (.yulai_she@guet.edu.cn)

    DOI:10.3788/IRLA20220514

    Topics