[1] [1] DOUGLAS W R, DOMINIC F H. Why automated optical inspection ［C］. International Test Conference, 1997:1033.

[2] [2] LIN SH CH, SU CH H. A visual inspection system for surface mounted devices on printed circuit board ［C］. Cybernetics and Intelligent Systems, 2006 IEEE Conference, 2006:1-4.

[3] [3] CHEN Y S, WANG C S, FAN C T, et al.. Reliability assessment of Sn-Pb and Pb-free solder joints under the cyclic bend and shear tests ［C］. Electronic Packaging Technology, ICEPT 2007, 8th International Conference, 2007:1-6.

[4] [4] LI ZH M, LIN Y W, HUANG J, et al.. Preprocess algorithm of PCB line detecting ［J］. Opt. Precision Eng., 2007,15(2):272-276. (in Chinese)

[5] [5] SHI J W. Solder defects and solutions in lead- free soldering technology ［J］. Electronics Process Technology, 2008,29(1):53-56. (in Chinese)

[6] [6] LU SH L, ZHANG X M, KUANG Y C. Neural network-based inspecting method of PCB solder joint ［J］. Journal of South China University of Technology (Natural Science Edition), 2008,36(5):135-139. (in Chinese)

[7] [7] WU L M, CUI SH L, WANG L P, et al.. Novel automatic inspection method for repetitive patterned wafer ［J］. Opt. Precision Eng., 2008,16(5):925-930. (in Chinese)

[8] [8] WU F P, ZHANG X M, KUANG Y C， et al.. An AOI algorithm for PCB based on feature extraction ［C］. Proceedings of the 7th World Congress on Intelligent Control and Automation, Chongqing,2008:240-247.

[9] [9] ROH Y J, LEE D Y, KIM M Y, et al.. A visual inspection system with flexible illumination and auto-focusing ［C］. Proc. of SPIE, 2002,4902:463-475.

[10] [10] LOH H H, LU M S. Printed circuit board inspection using image analysis ［J］. IEEE Transaction on Industry Applications, 1999,35(2):426-432.

[11] [11] KIM T H, CHO T H, MOON Y S, et al.. Visual inspection system for the classification of solder joints ［J］. Pattern Recognition, 1999,32(4):565-575.

[12] [12] JAGANNATHAN S. Automatic inspection of wave soldered joints using neural networks ［J］. Journal of Manufacturing Systems, 1997,16(6):389-398.

[13] [13] KO K W, CHO H S. Solder joints inspection using a neural network and fuzzy rule-based classification method ［J］. IEEE Transactions on Electronics Packaging Manufacturing, 2000,23(2):93-102.

[14] [14] ACCIANI G, BRUNETTI G, FORNARELLI G. Application of neural networks in optical inspection and classification of solder joints in surface mount technology ［J］. IEEE Transactions on Industrial Informatics, 2006,2(3):200-209.

[15] [15] LU SH L, ZHANG X M. Analysis of optimal design of illuminator for leafless tin solder joint inspection ［J］. Opt. Precision Eng., 2008,16(8):1377-1383. (in Chinese)