[2] [2] GUO Weida, CHINE Weining, WANG Chienlin, et al. Design of wideband impedance matching for through-hole via transition using ellipse-shaped anti-Pad[C]// 2006 IEEE Electrical Performance of Electronic Packaging. Scottsdale,AZ,USA:IEEE, 2006:245-248. doi:10.1109/EPEP.2006.321240.

[3] [3] LI Dong,XU Jianggang,ZHANG Bo, et al. GCPW to stripline vertical transition for K-band applications in LTCC[C]// 2015 Asia-Pacific Microwave Conference(APMC). Nanjing,China:IEEE, 2015:1-3.

[7] [7] LI Zhipeng,WANG Ping,ZENG Rong, et al. Analysis of wideband multilayer LTCC vertical via transition for millimeter-wave system-in-package[C]// 2017 the 18th International Conference on Electronic Packaging Technology(ICEPT). Harbin, China:IEEE, 2017:1039-1042. doi:10.1109/ICEPT.2017.8046620.

[8] [8] LEIB M,MIRBACH M,MENZEL W. An ultra-wideband vertical transition from microstrip to stripline in PCB technology[C]// 2010 IEEE International Conference on Ultra-Wideband. Nanjing,China:IEEE, 2010:1-4.