Fig. 1. (a) Physical model of system; (b) definition of thermal resistance length at interface.(a) 物理模型图; (b) 界面热阻长度定义

Fig. 2. Temperature and density profile of liquid along z direction when solid-liquid potential energy parameter : (a) ; (b) ; (c) . 固液势能参数 时, 流体沿着z方向的温度分布和密度分布　(a) ; (b) ; (c)

Fig. 3. (a) Density profile and (b) temperature profile of liquid along z direction when microchannel height H = 46.12σ. 微通道尺寸 时流体沿着z方向的(a) 密度分布和(b)温度分布

Fig. 4. Variation of temperature jump at solid-liquid interface with microchannel height.固液界面温度阶跃随微通道尺寸的变化

Fig. 5. Degree of closeness of actual and theoretical temperature of liquid versus microchannel height.液体实际温度与理论温度的接近程度随微通道尺寸的变化关系

Fig. 6. Variation of thermal resistance at solid-liquid interface with microchannel height: (a) Hot wall; (b) cold wall.固液界面热阻随微通道尺寸的变化　(a) 热壁面; (b) 冷壁面

Fig. 7. VDOS profile of solid atoms and liquid atoms located at interfaces when solid-liquid potential energy parameter . 固液势能参数为 时固液原子VDOS分布