Journal of Inorganic Materials, Volume. 36, Issue 9, 959(2021)

Preparation of Silicon Nitride with High Thermal Conductivity and High Flexural Strength Using YbH2-MgO as Sintering Additive

Weide WANG1...2, Huanbei CHEN3, Shishuai LI1,2, Dongxu YAO1,*, Kaihui ZUO1 and Yuping ZENG1 |Show fewer author(s)
Author Affiliations
  • 11. Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
  • 22. University of Chinese Academy of Sciences, Beijing 100049, China
  • 33. Nanjing Electronic Devices Institute, Nanjing 210016, China
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    Silicon nitride with high thermal conductivity was obtained by two-step sintering method using YbH2-MgO as sintering additive. The effect of YbH2-MgO on shrinkage behavior, phase composition, microstructure, thermal conductivity, and flexural strength was investigated. The nitrogen-riched and oxygen-lacked oxynitride liquid phase was generated owing to the elimination of SiO2 by YbH2. Both the removal of lattice oxygen and the growth of β-Si3N4 were stimulated by the liquid phase. Therefore, compared to Yb2O3-MgO doped sample, silicon nitride with enlarged grains, purified lattice and reduced intergranular phase was obtained. Ultimately, its thermal conductivity increased by 13.7% from 115.32 to 131.15 W·m-1·K-1 after sintering at 1900 ℃ for 24 h by substituting Yb2O3 with YbH2. Although the replacement of Yb2O3 by YbH2 leads to enhanced flexural strength at low temperature, it tends to reduce the flexural strength at high temperature. The optimal flexural strength of (1008±35) MPa was achieved after sintering at 1800 ℃ for 4 h. This variation related mainly to the exaggerated bimodal microstructure. This work signifies that YbH2-MgO is effective for obtaining Si3N4 ceramics with both high flexural strength and high thermal conductivity.

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    Weide WANG, Huanbei CHEN, Shishuai LI, Dongxu YAO, Kaihui ZUO, Yuping ZENG. Preparation of Silicon Nitride with High Thermal Conductivity and High Flexural Strength Using YbH2-MgO as Sintering Additive [J]. Journal of Inorganic Materials, 2021, 36(9): 959

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    Paper Information

    Category: RESEARCH ARTICLE

    Received: Dec. 8, 2020

    Accepted: --

    Published Online: Dec. 9, 2021

    The Author Email: YAO Dongxu (yaodongxu@mail.sic.ac.cn)

    DOI:10.15541/jim20200705

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