Opto-Electronic Engineering, Volume. 49, Issue 1, 210314-1(2022)
Study on multi-layered CFRP patch bonding joint based on laser 3D engraving technology
Fig. 1. Filling path diagram of yin and yang mould. (a) Yin mode filling path; (b) Yang mode filling path
Fig. 2. Example of algorithm validation. (a) Schematic diagram of damage contour construction; (b) Yin mold processing point constructed byalgorithm; (c) Yang mold processing point constructed by algorithm
Fig. 8. Failure surface topography. (a) Mechanical processing; (b) Laser treatment
Fig. 9. Sample surface morphology after processing. (a) , (c) Sample surface morphology with milling treatment at different magnification; (b), (d) Sample surface morphology with laser treatment at different magnification
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Xiaowei Zhu, Zhehao Pan, Wenfeng Yang, Shaolong Li, Yu Cao. Study on multi-layered CFRP patch bonding joint based on laser 3D engraving technology[J]. Opto-Electronic Engineering, 2022, 49(1): 210314-1
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Received: Sep. 26, 2021
Accepted: --
Published Online: Apr. 6, 2022
The Author Email: Cao Yu (yucao@wzu.edu.cn)