Infrared and Laser Engineering, Volume. 51, Issue 3, 20220087(2022)
Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)
Fig. 3. (a) SEM image of cascaded MMI and SEM image of a single MMI[38]; (b) Test image of cascaded MMI[38]; (c) Schematic diagram of a power beam splitter based on subwavelength grating structure[46]; (d) Experimental result of the beam splitter based on the subwavelength grating, the inset is the SEM image of the device[46]
Fig. 4. (a) and (b) are AWG electron microscope images and experimental results images based on SOI with a top silicon thickness of 500 nm, respectively[48]; (c) and (d) are AWG electron microscope images and experimental results images based on SOI with a top silicon thickness of 220 nm, respectively[50]
Fig. 5. (a)-(d) correspond to the transmission spectra of the four output ports of the mode division multiplexer TE0, TE1, TE2, and TE3, respectively[53]
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Xi Wang, Yingjie Liu, Zimeng Zhang, Jianing Wang, Yong Yao, Qinghai Song, Ke Xu. Research progress in 2 μm waveband on-chip photonic integrated devices (Invited)[J]. Infrared and Laser Engineering, 2022, 51(3): 20220087
Category: Special issue-Mid-infrared integrated optoelectronic technology
Received: Jan. 24, 2022
Accepted: Mar. 14, 2022
Published Online: Apr. 8, 2022
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