Electro-Optic Technology Application, Volume. 30, Issue 4, 16(2015)
Research on Optical Performance of LED by COB Packaging
References(2)
[4] [4] WU Hsueh-han, LIN Kuan-hong, LIN Shun-tian. Astudy on the heat dissipation of high power multi-chip COBLEDs[J]. Microelectronics Journal, 2012, 43(4): 280-287.
[5] [5] SIM Jae-Kwan, Ashok K, RA Yong-Ho, et al. Characteristic enhancement of white LED lamp using low temperature co-fired ceramic-chip on board package[J]. Current Applied Physics, 2012, 12(2): 494-498.
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XU Chun, YANG Lei, QU Shi-wei, WANG Yi-ran, ZHU Wei, QIAN Xing-lu, HE Xi-wen, WAN Lin-wei, ZOU Jun. Research on Optical Performance of LED by COB Packaging[J]. Electro-Optic Technology Application, 2015, 30(4): 16
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Received: Jul. 18, 2015
Accepted: --
Published Online: Sep. 8, 2015
The Author Email:
CSTR:32186.14.
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