Researching | A Bump Height Measurement Method Based on Optical Triangulation

Acta Photonica Sinica, Volume. 51, Issue 5, 0512001(2022)

A Bump Height Measurement Method Based on Optical Triangulation

Peng WANG1...2, Fanchang MENG2, Zili ZHANG2,*, Dezhao WANG2,3, Shan WANG2, Entao YAO1, Lei WANG4 and Ruiqian YE4 |Show fewer author(s)

Author Affiliations

¹College of Automation Engineering，Nanjing University of Aeronautics and Astronautics，Nanjing 211100，China

²Institute of Microelectronics of the Chinese Academy of Sciences，Beijing 100029，China

³Changchun University of Science and Technology，Changchun 130022，China

⁴Xiamen University，Xiamen，Fujian 361101，China

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Figures&Tables (8)

References (27)

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Figures & Tables(8)

Fig. 1. Structure of chip bump under scanning electron microscope

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Fig. 2. Schematic diagram of oblique incidence optical triangulation

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Fig. 3. Schematic diagram of chip bump height mathematical model

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Fig. 4. Experimental device for measuring chip bump height

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Fig. 5. RANSAC circle test results

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Fig. 6. Chip bump height measurement results

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Table 1. Comparison between displacement measured by laser interferometer and strip center displacement
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Table 1. Comparison between displacement measured by laser interferometer and strip center displacement
No. $Δ Z_{w} / μ m$ $Δ x / μ m$ No. $Δ Z_{w} / μ m$ $Δ x / μ m$ No. $Δ Z_{w} / μ m$ $Δ x / μ m$
1 0.00 0.00 5 40.59 214.44 9 81.32 433.45
2 10.31 51.37 6 50.23 266.38 10 91.21 485.34
3 22.65 117.67 7 62.07 330.05
4 30.21 157.58 8 69.99 370.49

Table 2. Chip bump height measurement error result
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Table 2. Chip bump height measurement error result
No. Error/μm No. Error/μm
1 -0.752 9 -0.487
2 -0.227 10 -0.024
3 -0.859 11 -0.464
4 0.549 12 0.626
5 0.773 13 0.232
6 -0.586 14 -0.072
7 0.435 15 1.071
8 -0.592 16 0.439

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Peng WANG, Fanchang MENG, Zili ZHANG, Dezhao WANG, Shan WANG, Entao YAO, Lei WANG, Ruiqian YE. A Bump Height Measurement Method Based on Optical Triangulation[J]. Acta Photonica Sinica, 2022, 51(5): 0512001

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Paper Information

Category: Instrumentation, Measurement and Metrology

Received: Nov. 19, 2021

Accepted: Jan. 7, 2022

Published Online: Jun. 27, 2022

The Author Email: ZHANG Zili (zhangzili@ime.ac.cn)

DOI:10.3788/gzxb20225105.0512001

Topics

laser devices and laser physics

Lasers and Laser Optics

laser manufacturing

Instrumentation, Measurement and Metrology