Electro-Optic Technology Application, Volume. 29, Issue 4, 24(2014)
Dual Channel Heat-dissipation Analysis of LED Luminaire with COB Plastic Substrate and Glass Encapsulation
[1] [1] Voigtlander B. Fundamental processes in Si/Si and Ge/Si epitaxy studied by scanning tunneling microscopy during growth[J]. Surface Science Reports, 2001, 43(5-8): 127-254.
[2] [2] ZHANG Da-wei, LI Bai-cheng, Huang, et al. A multi-layer phosphor package of white-light-emitting diodes with high efficiency [J]. Optik-International Journal for Light and Electron Optics, 2010, 121(24):2224-2226.
[3] [3] Hitzel F, Hangleiter A. The reason for the high emission efficiency of GaInN/GaN based LEDs[J]. Phys Lett B, 2008, 22:3261-3266.
[4] [4] Lee T H, Dickson R M. Single-Molecule LEDs from Nanoscale Electroluminescent Junctions[J]. J Phy Chem B, 2003, 107:7387-7390.
[5] [5] Jin X, Zhang B, Dai T, et al. Optimization of top polymer gratings to improve GaN LEDs light transmission[J]. Chin Opt Lett, 2008, 10:788-790.
[6] [6] Nogueira E, Vazquez M, Mateos J. Accelerated life test of high luminosity AlGaInP LEDs[J]. Technical Physics Letters.2012, 52(9):1853-1858.
[8] [8] Sim J K, Ashok K, Ra Y H. Characteristics enhancement of white LED lamp using low temperature co-fired ceramic chip on board package current [J]. App. Phys, 2012, 12(2):494-498.
[10] [10] Liang T, Guo X, Guan B L, et al. A flip-chip AlGaInP LED with GaN/Sapphire transparent substrate fabricated by direct wafer bonding [J]. Chin Phy. Lett, 2007, 24(4):1110-1113.
[11] [11] Fan Y Y, He B, Zhou J, et al. Efficient heat transfer in high-power fiber lasers [J]. Opt. Lett, 2012, 10(11):111401-11401.
[12] [12] Shen C, Feng H, Xu Z, et al. GaInN light-emitting diodes with omni-directional reflector using nanoporous SnO2 film[J]. Chin Opt. Lett, 2008, 6(2):152-153.
[13] [13] Wierer J J, Steigerwald D A, Krames M R. High-power AlGaInN flip-chip light-emitting diodes [J]. Phys. Lett, 2001, 78(22):3379-3381.
Get Citation
Copy Citation Text
HUANG Wei-ming, WEN Shang-sheng, CHEN Ying-cong. Dual Channel Heat-dissipation Analysis of LED Luminaire with COB Plastic Substrate and Glass Encapsulation[J]. Electro-Optic Technology Application, 2014, 29(4): 24
Category:
Received: May. 20, 2014
Accepted: --
Published Online: Sep. 15, 2014
The Author Email:
CSTR:32186.14.