A new encapsulating mode for LED luminaire is introduced. Dual channel heat-dissipation effect is obtained by using high thermal conductive glass shell and inert gas to encapsulate instead of traditional epoxy resin and using plastic heating-radiator instead of traditional aluminum substrate. The thickness of inert gas layer is optimized with ANSYS finite element thermal analysis software. Thermal simulation results are compared and analyzed through changing the number of LED, the power of a single LED and traditional ceramic substrate chip on board (COB) encapsulation mode. Research results show that heat-dissipation effect is better when the thickness of inert gas layer is 1.5 mm and the thermal resistance of dual channel heat-dissipation luminaire is far less than that of single channel. Comparing with traditional epoxy resin, plastic has the characteristics of high transmissivity, anti-aging and good anti-ultraviolet effect. The new encapsulation mode has widely application prospect in the market enviroment of widely development of UV LED luminaire with high power and intensive encapsulation.