Smooth objects such as metals, optical mirrors, and silicon wafers generally have extremely low emissivity and high reflectivity, and are called low emissivity objects. The extremely weak radiation from low emissivity objects will be submerged by the environmental radiation reflected from their surfaces. Infrared temperature measurement of low emissivity objects has always been a challenge in the field of infrared temperature measurement. Due to the continuously growing demand for non-contact temperature measurement of low emissivity objects in fields such as metal smelting, solar telescope thermal control, and semiconductor production, a large number of infrared temperature measurement methods for low emissivity objects have been proposed. First, this paper elaborates on the difficulties of the infrared temperature measurement of low emissivity objects and summarizes the temperature measurement methods currently used for low emissivity objects into five categories. Then, the basic principles and technical routes of each temperature measurement method were summarized, and the advantages and disadvantages of each temperature measurement method were analyzed in detail. Finally, the possible development directions of temperature measurement for low emissivity objects were discussed.