Optics and Precision Engineering, Volume. 12, Issue z1, 272(2004)

Research on hot embossing and thermal bonding for fabrication of PMMA microfluidic chips

[in Chinese]1, [in Chinese]2, [in Chinese]1, and [in Chinese]1
Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    References(8)

    [1] [1] MANZ A, GRABER N, WIDMER H M. Miniaturized total analysis systems: a novel concept for chemical sensing [J]. Sensors Actuators, 1990, (1) B: 244-248.

    [3] [3] LIU Z Y,LOH N H,TOR S B,et al. Binder system for micropowder injection molding[J]. Materials Letters, 2001(48) : 31-38.

    [4] [4] ROBERTS M A, JOEL R, PAUL B,et al. UV Laser machined polymer substrates for the development of microdiagnostic systems[J]. Anal Chem, 1997, (69) :2035-2042.

    [5] [5] LADE R J,MORLEY I W,MAY P W,et al. ArF (193nm) laser ablation of poly(methyl methacrylate)[J]. Diamond and Related Materials, 1999, (8) : 1654-1658.

    [6] [6] BENEDIKT G,ANDREAS N,MATTHIAS J,et al. A new PMMA-microchip device for isotachophoresis with integrated conductivity detector[J]. Sensors and Actuators, 2001, (72)B: 249-258.

    [7] [7] HEYDERMAN L J,SCHIFT H, DAVID C, et al. Flow behaviour of thin polymer films used for hot embossing lithography[J]. Microelectronic Engineering, 2000(54) :229-245.

    [8] [8] Ong N S, Koh Y H, Fu Y Q. Microlens array produced using hot embossing process[J]. Microelectronic Engineering, 2002, (60): 365-379.

    [9] [9] BECKER H,HEIM U. Hot embossing as a method for the fabrication of polymer high aspect ratio structures[J].Sensors and Actuators, 2000, (83) B:130-135.

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    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Research on hot embossing and thermal bonding for fabrication of PMMA microfluidic chips[J]. Optics and Precision Engineering, 2004, 12(z1): 272

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    Paper Information

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    Received: Feb. 22, 2004

    Accepted: --

    Published Online: Nov. 3, 2006

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