[1] [1] Wong H S, Yao Y L, Schlig E S. TDI charge-coupled devices: design and applications[J]. IBM J. of Research and Development, 1992, 36(1): 83-106.

[2] [2] Bello D S S, Boulenc P, Vandebriel R, et al. A 7-band CCD-in-CMOS multispectral TDI imager[C]// Inter. Image Sensor Workshop, 2017: 129-132.

[3] [3] Boulenc P, Thijs S, Bello D S S, et al. Multi-spectral high-speed backside illuminated TDI CCD-in-CMOS imager[C]// Inter. Image Sensor Workshop, 2019: R47.

[5] [5] Ko C T, Chen K N. Wafer-level bonding/stacking technology for 3D integration[J]. Microelectronics Reliability, 2010, 50(4): 481-488.

[6] [6] Chen Y, Xu Y, Mierop A J, et al. Column-parallel digital correlated multiple sampling for low-noise CMOS image sensors[J]. IEEE Sensors J., 2011, 12(4): 793-799.

[7] [7] Kawai N, Kawahito S. Effectiveness of a correlated multiple sampling differential averager for reducing 1/f noise[J]. IEICE Electronics Express, 2005, 2(13): 379-383.

[8] [8] Suh S, Itoh S, Aoyama S, et al. Column-parallel correlated multiple sampling circuits for CMOS image sensors and their noise reduction effects[J]. Sensors, 2010, 10(10): 9139-9154.

[9] [9] Guo J. DLL based single slope ADC for CMOS image sensor column readout[D]. Delft: TU Delft, 2011.

[10] [10] Gao W, Gao D, C Huguo, et al. Design of a 12-bit 2.5 MS/s integrated multi-channel single-ramp analog-to-digital converter for imaging detector systems[J]. IEEE Trans. on Instrumentation and Measurement, 2011, 60(6): 1942-1951.

[11] [11] Turchetta R, Guerrini N, Sedgwick I. Large area CMOS image sensors[J]. J. of Instrumentation, 2011, 6(1): C01099.