Microwave dielectric ceramics prepared via a conventional method usually require a high sintering temperature (i.e., >1 000 ℃) and long sintering time, leading to a high energy consumption and a difficulty to realize the integration and co-firing of multiple material system. Continuous innovation and development of wireless communication technology put forward higher requirements for the miniaturization and integration of microwave devices, so that some technologies for preparing low-temperature co-fired ceramic (LTCC) and ultralow-temperature co-fired ceramic (ULTCC) are developed. Developing green sintering technologies with lower sintering temperatures and higher sintering efficiencies becomes one of the research hotspots. Novel sintering technologies (i.e., liquid-phase sintering, hot press sintering, microwave sintering, spark plasma sintering, and flash sintering) promote the development of microwave dielectric ceramics. A novel ultra-low temperature sintering technology called cold sintering process is proposed. The sintering temperature of cold sintering process is rather low (≤300 ℃), which can densify ceramics in a short time, and has some advantages in the phase stability, co-firing of multiple materials and grain boundary manipulation, thus providing an opportunity for the development of ultra-low temperature sintering technology and microwave dielectric material system.