Journal of Inorganic Materials, Volume. 36, Issue 2, 197(2021)

High Temperature Interfacial Stability of Fe/Bi0.5Sb1.5Te3 Thermoelectric Elements

Xu WANG1...2, Ming GU1, Jincheng LIAO1, Qingfeng SONG1, Xun SHI1, Shengqiang BAI1,*, and Lidong CHEN12 |Show fewer author(s)
Author Affiliations
  • 11. State Key Laboratory of High Performance Ceramics and Superfine Microstructure, Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 201899, China
  • 22. Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
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    Figures & Tables(7)
    Low magnification SEM images of the micro-interfaces in the as-prepared co-sintered sample for screening of the barrier layer materials (a) Cr, Fe, Co, Ti; (b) Al, Zr
    Surface mapping of the micro-interfaces between P-BT matrix and 6 barrier layer candidate particles aged at 300 ℃ for 2 d
    (a) Interfacial microstructure of the as-prepared Fe/P-BT TE element before aging and (b) line scanning of the as-prepared Fe/P-BT interface
    Cross sectional microstructures of the Fe/P-BT interface after aging at different temperatures for different time
    (a) Variation of the diffusion layer thickness at the Fe/P-BT interface with the square root of aging time at 300, 325 and 350 ℃, and (b) variation of lnD with 1000/T between 300 and 350 ℃
    Evolution of the Fe/P-BT interfacial resistivity with aging time at 350 ℃
    • Table 1.

      Fitting results of the growth rates of the diffusion layers, the relationship between diffusion layer thickness and aging time, and predicted service lives of the Fe/P-BT element at different temperatures

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      Table 1.

      Fitting results of the growth rates of the diffusion layers, the relationship between diffusion layer thickness and aging time, and predicted service lives of the Fe/P-BT element at different temperatures

      Temperature/D/(×10-18, m2∙s-1)(Y-Y0)/μmPredicted service life*/d
      3007.292.7×10-3t0.5428
      32565.18.1×10-3t0.552
      350203.114.3×10-3t0.516
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    Xu WANG, Ming GU, Jincheng LIAO, Qingfeng SONG, Xun SHI, Shengqiang BAI, Lidong CHEN. High Temperature Interfacial Stability of Fe/Bi0.5Sb1.5Te3 Thermoelectric Elements[J]. Journal of Inorganic Materials, 2021, 36(2): 197

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    Paper Information

    Category: RESEARCH LETTERS

    Received: Mar. 10, 2020

    Accepted: --

    Published Online: Nov. 24, 2021

    The Author Email: BAI Shengqiang (bsq@mail.sic.ac.cn)

    DOI:10.15541/jim20200126

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