[1] [1] S. E. Miller. Integrated optics: an introduction [J]. Bell System Technical Journal, 1969, 48(9): 2059～2069

[2] [2] Hongchun Xu. The technology evolution of optical integration in the optical active devices［J］. J. Materials Science and Engineering, 2010, 4(3): 80～84

[3] [3] Guo Fuyuan, Li Lianhuang, Wang Minghua. Gaussian approximation for mode field distribution of dielectric planar waveguide TE0 mode［J］. Chinese J. Lasers, 2008, 35(2): 235～239

[4] [4] Yasuo Kokubun. Lightwave Engineering［M］.Wang Yougong Transl.. Beijing: Science Press, 2002. 221～227

[5] [5] N.Grote, H.Venghaus. Fibre Optic Communication Devices［M］.Wang Jingshan, Shen Xinjie, Sun Wei Transl.. Beijing: National Defense Industry Press, 2003. 411～432

[6] [6] Jung Woon Lim, Sung Hwan Hwang et al.. Low-cost hybrid WDM module integrated on planar lightwave circuit (PLC) with a coated WDM filter using passive alignment technique［C］. Proc. 57th ECTC 2007, 1959～1963

[7] [7] G. Roelkens, L. Liu et al.. Wafer bonding and heterogeneous integration: III-V/silicon photonics［C］. Proc. 14th ECIO 2008: 87～90

[8] [8] Xponent Introduces a New Way to Build Optical Components［EB/OL］. [2003-03-23] http://www.hoyaxponent.com/news/rel_030323.html

[9] [9] David W. Vernooy, Albert M. Benzoni, et al.. Surface mount photonics as a platform for optoelectronic packaging ［J］.IEEE Lasers and Electro-Optics Society, 2003, (1): 370～371

[10] [10] Surface-mount photonics simplifies optical assembly ［EB/OL］. [2004-06-01] http://www.laserfocusworld.com/articles/print/volume-40/issue-6/optoelectronics-manufacturing/surface-mount-photonics-simplifies-optical-assembly.html

[11] [11] Zhao Junliang, Xue Zhonghui, Guan Rongfeng et al.. Realization of SiOB packaging design and processing of laser transmitter and receiver［J］. J. Henan University (Natural Science), 2006, 36(6): 29～33

[12] [12] Gohji Nakagawa, Tsuyoshi Yamamoto et al.. High power and high sensitivity planar lightwave circuit module incorporating a novel passive alignment method［J］. IEEE J. Lightwave Technol., 1998, 16(1): 66～72

[13] [13] Li Xiaoxuan, Wang Tingyue, Yu Shenglin et al.. A study on flip chip bonding technology［J］. Electro-Mechanical Engineering, 2008, 24(5): 28～33

[14] [14] Yu Kurata, Yusuke Nasu, Munehisa Tamura et al.. Heterogeneous integration of high-speed InP PDs on silica-based planar lightwave circuit platform ［C］. Proc. 37th Optical Communication (ECOC), 2011. 1～3

[15] [15] Takara Sugimoto, Takanori Shimizu et al.. A small and low cost bidirectional transceiver module with polymer waveguide for G-PON/GE-PON［C］. Proc. 57th ECTC 2007. 707～711

[16] [16] Yao Qinze. Semiconductor device packaging technology［J］. ShangQin, 2010, 21: 92～93