Optics and Precision Engineering, Volume. 31, Issue 15, 2203(2023)

Fabrication and optimization of high-temperature uniform rapid heating module for glass hot embossing

Xin WANG1, Feng GONG1, Chifai CHEUNG2, and Gao YANG1、*
Author Affiliations
  • 1Shenzhen Key Laboratory of High-performance Nontraditional Manufacturing, College of Mechatronics and Control Engineering, Shenzhen University, Shenzhen58060, China
  • 2State Key Laboratory of Ultra-precision Machining Technology, Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hong Kong999077, China
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    Figures & Tables(26)
    Measurement setup for surface temperature of ceramic heater
    Temperature histories of various points on surface of ceramic heater
    Geometric model of heating module
    Experimental devices of Si3N4 ceramic heater
    Structure of even-heat block
    Analysis of heat transfer in heating stage
    Verification of repeatability of temperature measurement
    Temperature histories of measurement points from P1 to P12 in 180-second constant voltage heating test
    Thermophysical properties of copper
    Mesh of heating module
    Temperature distribution on upper surface of even-heat block under constant-voltage heating for 180 s
    Comparison of simulation and constant-voltage heating experimental results
    Comparison of simulation and experimental results when heating for 180 s
    Geometric meaning of factors
    Influence of various factors on heating rate
    Influence of various factors on temperature uniformity
    Optimized structure of even-heat block
    Temperature histories of measurement points from P1 to P12 in 180-second constant voltage heating test
    Comparison of temperature uniformity before and after optimization
    Heating to 700 ℃ under control
    Hot embossing machine
    Surface topography of silicon carbide mold and glass microstructure arrays
    • Table 1. Thermophysical parameters of each material of heating module

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      Table 1. Thermophysical parameters of each material of heating module

      名 称材料密度/(kg·m-3比热/(J·kg-1·℃-1热传导系数/(W·m-2·℃-1
      陶瓷加热片发热丝19 350134179
      陶瓷加热片基体氮化硅3 20071020
      匀热块8 92021--
      隔热板云母2 8002060.43
      绝缘套氧化锆57 0008502
    • Table 2. Factors and their levels

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      Table 2. Factors and their levels

      水平因素WXDH
      15022105
      2552410.56
      36026117
      4652811.58
      57030129
    • Table 3. Orthogonal test results

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      Table 3. Orthogonal test results

      实验

      编号

      W/mm

      X/

      mm

      D/

      mm

      H/

      mm

      温度

      /℃

      温差

      /℃

      实验

      编号

      W/mm

      X/

      mm

      D/

      mm

      H/

      mm

      温度

      /℃

      温差

      /℃

      15022105944.3916.57146028106847.5713.20
      2502410.56924.5611.4915603010.57826.859.14
      35026117904.807.8516652211.59746.3717.54
      4502811.58885.365.37176524125729.8520.72
      55030129865.784.12186526106805.5319.15
      6552210.57873.8216.6519652810.57784.6914.44
      75524118853.5712.67206530118764.1910.64
      8552611.59835.038.85217022126690.5222.66
      95528125818.4510.89227024107765.6624.78
      105530106893.227.9523702610.58746.1319.06
      116022118807.2017.67247028119717.0517.20
      12602411.59788.7713.1025703011.55708.9617.76
      136026125771.2520.32
    • Table 4. Analysis of results

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      Table 4. Analysis of results

      因素温 度温 差
      K1K2K3K4K5极差RK1K2K3K4K5极差R
      W898.978854.818808.328766.126725.664173.3149.08011.40214.68616.49820.29211.212
      X812.460812.482812.548804.624811.8007.94218.21816.55215.04612.2209.9228.296
      D851.274831.210809.362786.898775.17076.10416.33014.15613.20612.52415.7423.806
      H812.386810.490813.000806.366811.6726.63414.05214.90015.23613.79813.9721.438
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    Xin WANG, Feng GONG, Chifai CHEUNG, Gao YANG. Fabrication and optimization of high-temperature uniform rapid heating module for glass hot embossing[J]. Optics and Precision Engineering, 2023, 31(15): 2203

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    Paper Information

    Category: Micro/Nano Technology and Fine Mechanics

    Received: Mar. 7, 2023

    Accepted: --

    Published Online: Sep. 5, 2023

    The Author Email: YANG Gao (gao.yang@szu.edu.cn)

    DOI:10.37188/OPE.20233115.2203

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