International Journal of Extreme Manufacturing, Volume. 6, Issue 1, 15102(2024)

Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates

Zhiwen Shu1...2, Bo Feng1,2, Peng Liu3, Lei Chen1,2, Huikang Liang1,2, Yiqin Chen1,2,4, Jianwu Yu1, and Huigao Duan1,24,* |Show fewer author(s)
Author Affiliations
  • 1College of Mechanical and Vehicle Engineering, National Engineering Research Centre for High Efficiency Grinding, Hunan University, Changsha 410082, People’s Republic of China
  • 2Greater Bay Area Institute for Innovation, Hunan University, Guangzhou 511300, People’s Republic of China
  • 3School of Mechanical Engineering, Hunan University of Science and Technology, Xiangtan 411201, People’s Republic of China
  • 4Shenzhen Research Institute, Hunan University, Shenzhen 518000, People’s Republic of China
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    Zhiwen Shu, Bo Feng, Peng Liu, Lei Chen, Huikang Liang, Yiqin Chen, Jianwu Yu, Huigao Duan. Near-zero-adhesion-enabled intact wafer-scale resist-transfer printing for high-fidelity nanofabrication on arbitrary substrates[J]. International Journal of Extreme Manufacturing, 2024, 6(1): 15102

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    Paper Information

    Received: Aug. 10, 2023

    Accepted: --

    Published Online: Jul. 19, 2024

    The Author Email: Duan Huigao (duanhg@hnu.edu.cn)

    DOI:10.1088/2631-7990/ad01fe

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